Startech · Computers

StarTech.com Thermal Paste Metal Oxide Compound Re-sealable Syringe (1.5g) CPU Heat Sink Thermal Grease Paste Thermal paste 1.93 W/mK Silver 0.12 C/W 1.7 g/cm -30 - 180 C

Provide optimal heat transfer between CPU and heatsink through a metal oxide compound - Metal-based compound containing metal oxide - Thermal conductivity of more than 1.93 W/m-K - Negligible electrical conductivity - Stable performance over a wide temperature range - 4-6 applications per tube - Resealable syringe applicator Applications - High demand applications such as overclocking and high performance CPUs - Replace old or dried out thermal paste Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste providing optimum protection against CPU heat damage. The StarTech.com Advantage - Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications Warranty Information Warranty: 2 Years Performance Bleed: Evaporation: Specific Gravity: >1.7 at 25 C Thermal Conductivity: >1.93 W/m-K at 25 C Thermal Resistance: Environmental Operating Temperature: -30C to 180C (-22F to 356F) Physical Characteristics Colour: Silver Materials: Silicone Compounds 50% Carbon Compounds: 30% Metal Oxide Compounds: 20% Product Length: 67 mm [2.6 in] Product Weight: 10 g [0.4 oz] Product Width: 20 mm [0.8 in] Packaging Information Shipping (Package) Weight: 0 kg [0 lb] What's in the Box Included in Package: 1 - 1.5g tube of thermal grease

90-day range £∞–-£∞ · average £NaN