Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g

Gembird · Accessories

Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g

Thermal silicone compound (grease) for heatsinksHelps the heat dissipation from a CPU. chipset or processor to a heatsinkExcellent thermal impedancePerfect stability - will not separate. run. migrate. or bleedNon capacitive or electrically conductive

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